Fully-auto BGA rework station MD-A2E
Fully-auto BGA rework station MD-A2E
  • Fully-auto BGA rework station MD-A2E

Fully-auto BGA rework station MD-A2E


Features
▶Embedded industrial PC, three independent heating zones, Panasonic CCD camera system, high-definition touch screen dialogue interface, PLC control, multi-function integrated control, folding optical lens, can store and select temperature profiles.
▶High-precision k-type thermocouple closed-loop control and PID automatic temperature compensation system, using PLC and temperature modules and intelligent control units, can achieve a temperature control deviation of ±1°C. The external temperature measuring connector can realize the precise analysis of temperature setting and real-time temperature curve.
▶There are two operating modes in the system: Auto/Manual. Auto Mode: Auto Feeding System, Auto BGA/IC Pick and Place, Auto Positioning, Soldering and Desoldering. Manual mode: manually up/down the top gimbal, with joystick, to manually control camera movement. Both modes combine optical focusing and laser positioning to complete the process. The built-in vacuum suction cup can easily pick up the bga chip.

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Fully-auto BGA rework station MD-A2E

1. Embedded industrial PC, three independent heating zones, Panasonic CCD camera system, high-definition touch screen dialogue interface, PLC control, multi-function integrated control, folding optical lens, can store and select temperature profiles.
2. High-precision k-type thermocouple closed-loop control and PID automatic temperature compensation system, using PLC and temperature modules and intelligent control units, can achieve a temperature control deviation of ±1°C. The external temperature measuring connector can realize the precise analysis of temperature setting and real-time temperature curve.
3. With stepping motor driver: stable, reliable, safe and efficient; with high-definition visual optical alignment system; accurate positioning of PCB board, PCB can be adjusted in X, Y, Z directions, with "5-point support" + V groove pcb bracket + universal clamp.
4. There are two operating modes in the system: Auto/Manual. Auto Mode: Auto Feeding System, Auto BGA/IC Pick and Place, Auto Positioning, Soldering and Desoldering. Manual mode: manually up/down the top gimbal, with joystick, to manually control camera movement. Both modes combine optical focusing and laser positioning to complete the process. The built-in vacuum suction cup can easily pick up the bga chip.
5. Multi-function: "Quick Positioning", "Keep Warm", "Pressure Sensor", "Instant Temperature Analysis", "Voice Warning Before Heating Completed", "HD Vision Optical Alignment", "High Precision Temperature Control", etc.
6. Laser positioning: It helps to quickly place the PCB on the center point, and has a "5-point support position", which is more convenient and accurate.
7. Movable universal clamp can prevent PCB damage on edge components, suitable for various PCB repairs.
8. High-power LED lights ensure working brightness, and different sizes of magnet nozzles are used for easy replacement and installation.
9. The three heating zones can be heated independently, they are multiple temperature controls, which can ensure the best integration of different temperature zones. Heating temperature, time, slope, cooling and vacuum can all be set and controlled in the touch screen dialog interface. At the same time, PID calculation makes the heating process control more accurate and stable.
10. 6-8 sections of temperature can be set for top heating and bottom heating (up to 16 sections), 50,000 sets of temperature curves can be stored, and can be numbered, modified and applied at any time according to different BGAs. .
11. Voice warning 5-10 seconds before the completion of heating: remind the operator to pick up the bga chip on time. After heating, the cooling fan will automatically work, and when the temperature cools down to room temperature (<45°C), the cooling system will automatically stop to prevent the heater from aging.
12. Double protection: overheat protection + emergency stop function.
13. CE certification approval.
SPECIFICATION
 
Total Power 5200W
Top heater 1200W
Bottom heater 2nd 1200W, 3rd IR heater 2700W
Power AC220V±10     50Hz
Feeding system Auto feeding system for chip
Operation mode Two modes: manual and automatic, free choose!
HD touch screen, intelligent man-machine, digital system setting.
Temperature profile storage 50000 groups
Optical CCD camera lens Automatic stretching out and folding to pick and place bga chip
Camera magnification 10x - 220x
Workbench fine-tuning: ±15mm forward/backward,  ±15mm right/left
Placement accuracy: ±0.01mm
Bga positioning Laser positioning, fast and accurate position of pcb and bga
PCB position Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures.
Lighting Original led working light, any angle adjustable
Temperature control K sensor, close loop, PLC control
Temp accuracy ±1℃
PCB size Max 450×400 mm Min 22×22 mm
BGA chip 1x1 - 80x80 mm
Minimum chip spacing 0.1mm
External temper sensor 1pc
Dimensions L600×W700×H850 mm
Net weight 70KG

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