News · Updated 2026-10-26
Koh Young Debuts 3D AI Innovations
Seoul, Korea – Industry leader Koh Young will showcase breakthrough True 3D inspection and metrology solutions at Productronica and SEMICON Europa 2025 (Nov 18–21, Messe München, Germany).
Seoul, Korea – Industry leader Koh Young will showcase breakthrough True 3D inspection and metrology solutions at Productronica and SEMICON Europa 2025 (Nov 18–21, Messe München, Germany).
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Koh Young’s new offerings combine True 3D measurement with AI and automation to boost quality, efficiency, and process control:
THT Inspection: New algorithms for through-hole/press-fit joints reduce defects and rework in mixed-technology assemblies.
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KSMART: Data analytics platform turns inspection data into real-time insights for smart factory optimization.
KAP Auto-Programming: AI-generated inspection programs cut setup time from hours to minutes.
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Smart Review: Intelligent defect filtering minimizes operator workload and speeds up corrections.
KY8030-3 SPI: Telecentric lens + 8MP camera delivers sharper solder paste measurement and printing accuracy.
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Zenith 2 AOI: Side-view cameras detect hidden/obscured defects missed by traditional systems.
Zenith UHS AOI: Inspects tall components (up to 60mm) for EV, power electronics, and data infrastructure.
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aSPIre3: High-precision True 3D SPI for fine-pitch/advanced designs.
Zenith Alpha HS+: High-speed True 3D AOI balancing speed and accuracy for high-volume SMT production.
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Neptune C+: Inspects transparent/conformal coatings via patented LIFT technology.
Meister D+: Sub-micron accuracy semiconductor metrology for advanced packaging’s reflective/complex surfaces.
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