Lead Free SMT Reflow Oven XMR-1000D

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Reflow Oven
Lead Free SMT Reflow Oven XMR-1000D
In SMT reflow systems the heat tranfer takes place by full convection.
Transmission part
Heating and welding area
Vacuum unit
Cooling area
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Lead Free SMT Reflow Oven XMR-1000D

Product Details Cases & FAQ Related Products
PRODUCT OVERVIEW
Lead Free SMT Reflow Oven XMR-1000D
In SMT reflow systems the heat tranfer takes place by full convection. Heated process gas (air, nitrogen) is guided on the products by nozzle plates. The resulting temperature profile has to be conform with guidelines of component and solder paste manufacturer.
transmission part/heating and welding area/vacuum unit/cooling area and recovery system
APPLICATIONS & TARGET CUSTOMERS
Who Is It Built For?
Typical soldering & reflow lines this Lead Free SMT Reflow Oven XMR-1000D is specified into — matched by board size, takt time and process control needs.
1
Automotive Electronics
stable thermal profiles for heavy copper boards
2
Consumer Electronics
fast changeover between high-volume profiles
3
Industrial Control
uniform heating across large, thick assemblies
4
Medical Electronics
repeatable profiles with full process records
DELIVERY CASE / AUTOMOTIVE ELECTRONICS
Dual-Table Depaneling with Full Tracing
Barcode, vision alignment, dust collection and MES data interfaces were integrated, cutting manual handling and improving production record integrity.
How is the process profile matched to our boards?
What are the key capabilities of the Lead Free SMT Reflow Oven XMR-1000D?
Can samples be tested on our own PCBs before shipment?
What information is needed to quote this machine?
Not Sure Which Equipment Fits?
Share your PCB, capacity and process goals — our engineers will recommend the right configuration.
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