1. Non-destructive Testing

X-ray inspection, as a non-destructive testing method, does not physically damage PCBs or welded components. This allows manufacturers to monitor solder quality in real time during production, identifying and resolving potential issues without negatively impacting final product performance.

Compared to some destructive testing methods, X-ray inspection can ensure product quality while reducing testing costs and improving production efficiency.

By utilizing this non-destructive testing method, we can measure the void ratio in solder joints after SMT reflow soldering, eliminate defective products, and ensure that heat from the LEDs is perfectly transferred to the aluminum substrate, thereby ensuring that the lamp life meets design requirements.

2. High-resolution Imaging and High Reliability

X-ray inspection technology can capture high-resolution images of even the smallest details, such as solder joints, ensuring a comprehensive and detailed inspection of solder joint quality.

Even internal defects that are difficult to detect with traditional inspection methods can be clearly visualized in X-ray images, providing inspectors with accurate and reliable results.

3. Ability to Handle Complex Package Structures

With the development of the electronics industry, PCBs with high density and complex package structures are increasingly common.

X-ray inspection technology, with its powerful penetrating power and precise imaging, can easily meet the inspection needs of these complex package structures, promptly detecting and repairing potential solder defects, ensuring the high performance of PCBs.

4. Support for Batch Inspection and Automated Production

X-ray inspection technology can not only be used to inspect individual PCBs, but can also be well integrated into the in-line inspection process of mass production. Combined with advanced automation equipment, X-ray inspection enables fast and efficient quality control during large-scale production.

Common Problems and Solutions in X-ray Inspection

1. Solder Voids

Voids within solder joints are a common defect in SMT (Surface Mounting) processing, particularly in BGA soldering.

Excessively large voids can weaken the mechanical strength and electrical conductivity of the solder joint, affecting the stable operation of electronic components.

X-ray inspection technology can accurately measure the size, shape, and distribution of voids, ensuring that the void rate is kept within a reasonable range.

2. Solder ball deformation or depression

During the BGA soldering process, solder ball deformation or depression can seriously affect soldering results. Abnormal solder ball shape can lead to poor contact, reduced conductivity, and even cause problems such as cold solder joints.

X-ray inspection can clearly detect abnormal solder ball shape and provide timely warning of soldering quality issues.

3. Workpiece misalignment

During the SMT placement process, workpiece misalignment can occur due to machine failure, operational errors, or material quality issues. Workpiece misalignment can affect the assembly accuracy and electrical performance of electronic components, leading to product malfunction. X-ray inspection can accurately verify the workpiece position, allowing timely detection and correction of misalignment issues.