During the SMT process, the nozzle is easy to stick to solder paste or dirt, etc. If it is not maintained for a long time or the cleaning is not thorough during maintenance, the solder paste and dirt will harden, resulti
During the SMT process, the nozzle is easy to stick to solder paste or dirt, etc. If it is not maintained for a long time or the cleaning is not thorough during maintenance, the solder paste and dirt will harden, resulti
