The fully automatic nozzle cleaning machine-XMN-30 is a high-precision Nozzle Cleaning Machine engineered to maintain optimal performance of SMT Nozzles by removing solder paste and flux residue efficiently. As an Automatic Nozzle Cleaning device, the XMN-30 uses high-pressure jet pulse cleaning with purified water (pH 5-7), ensuring that the inner walls of nozzles are cleaned thoroughly without damage or environmental harm.
This SMT Nozzle Cleaner supports nozzle sizes from 01005 up to 2125 and can handle up to 30 nozzle pieces per cycle. Air source with compressed air (0.5-0.6 MPa) during cleaning, injection pressure ≤0.4 MPa, and an air consumption of less than 200 NL/min ensures efficient yet safe Automatic Cleaning Machine operation without excessive resource use. Rated power is max 200W, with a size of approximately 580 × 460 × 480 mm and a weight of ~50 kg, making the device compact enough for SMT line integration.
“PCB SMT Nozzle Cleaning” becomes less labor-intensive when using this machine: the Nozzle Cleaning Machine operates automatically, greatly reducing manual maintenance, minimizing downtime, and improving process reliability. Whether used for frequent nozzle maintenance in a high-mix SMT facility or critical applications needing clean nozzles for fine-pitch components, the XMN-30 Automatic Nozzle Cleaning Machine delivers intensive cleaning performance, safety, and consistent nozzle quality.
