Reflow Oven
Lead Free SMT Reflow Oven XMR-1000D
In SMT reflow systems the heat tranfer takes place by full convection.
Transmission part
Heating and welding area
Vacuum unit
Cooling area
Replies within 12 hours · layout assessment & sample testing
PRODUCT OVERVIEW
Lead Free SMT Reflow Oven XMR-1000D
In SMT reflow systems the heat tranfer takes place by full convection. Heated process gas (air, nitrogen) is guided on the products by nozzle plates. The resulting temperature profile has to be conform with guidelines of component and solder paste manufacturer.
transmission part/heating and welding area/vacuum unit/cooling area and recovery system
APPLICATIONS & TARGET CUSTOMERS
Who Is It Built For?
Typical soldering & reflow lines this Lead Free SMT Reflow Oven XMR-1000D is specified into — matched by board size, takt time and process control needs.
1
Automotive Electronics
stable thermal profiles for heavy copper boards
2
Consumer Electronics
fast changeover between high-volume profiles
3
Industrial Control
uniform heating across large, thick assemblies
4
Medical Electronics
repeatable profiles with full process records
DELIVERY CASE / TURNKEY SMT LINE
Built, Linked and Handed Over as One Line
Printer, mounters, reflow, AOI and board handling were delivered as one package: layout agreed up front, machines aligned to a single conveyor height, barcode and MES hand-over tested end to end, and the line signed off against the takt time agreed in the contract - so production starts on the planned day instead of being re-commissioned machine by machine.
Line layout & simulation
Conveyor linking
MES / traceability
On-site commissioning
DELIVERY CASE / AUTOMOTIVE ELECTRONICS
Dual-Table Depaneling with Full Tracing
Barcode, vision alignment, dust collection and MES data interfaces were integrated, cutting manual handling and improving production record integrity.
How is the process profile matched to our boards?
Profiles are developed against your board stack-up, paste and component mix, then verified with thermocouple measurements during factory acceptance testing. Heating zones and conveyor speed are set so that heavy copper and thermally sensitive areas both stay inside the process window.
What are the key capabilities of the Lead Free SMT Reflow Oven XMR-1000D?
Transmission part; Heating and welding area; Vacuum unit.
Can samples be tested on our own PCBs before shipment?
Yes. Functional tests, precision checks, continuous running and safety checks are carried out against your own samples before shipment, with acceptance video and reports delivered to you. Share your board data and process requirements and we will confirm the test plan.
What information is needed to quote this machine?
Send PCB dimensions and thickness, BOM, target capacity, product type and inspection requirements. Our engineers reply with a configuration sheet, itemized quotation and a confirmed lead time window within one to two business days.
Not Sure Which Equipment Fits?
Share your PCB, capacity and process goals — our engineers will recommend the right configuration.
Talk to an Engineer