Fully-auto BGA rework station ZMW-750
Fully-auto BGA rework station ZMW-750
  • Fully-auto BGA rework station ZMW-750

Fully-auto BGA rework station ZMW-750


Features
    Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
    PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the
chips,make sure the rework rate.

    Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling.
    Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction model weld,remove,mount,manual,realize semi auto and auto function ,meet customer’s requirement
    High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
    Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
    Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
    High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
    Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

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Product Details
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The Fully-auto BGA rework station ZMW-750 is a high-precision Automatic BGA Rework system engineered for modern SMT repair workflows. As a Fully-auto BGA Rework Station, the ZMW-750 integrates BGA Repair, Optical Alignment Repair Equipment, and SMT Rework Station capabilities in one compact module.

It includes three independent heating zones—top, bottom, and IR—with individually programmable temperature, time, and slope curves. Six heating sections simulate full reflow profiles (preheat, soak, reflow, cooling) to match specialized BGA rework needs. The station achieves temperature control accuracy within ±1 °C using K-type closed-loop sensors and PID compensation.

Auto functions include chip feeding, pickup, blowing, positioning, soldering, and desoldering. It supports Auto and Manual modes: in auto mode it handles the full cycle (feed, pick/place, solder, reflow), and in manual mode joystick or camera control allows operator intervention. The optical alignment system (via CCD + lens) provides alignment precision within ±0.01–0.02 mm, with motorized micrometer adjustment in X/Y/R axes.

Top and mounting heaters operate in a 2-in-1 configuration for precise chip placement. The system offers changeable BGA nozzles for diverse chip sizes, universal clamps, “5-point support” holders, laser positioning, movable universal clamps to avoid damaging edge components, and HD lighting for visibility. Dual camera monitoring is optional to observe solder melting and quality. It supports storage of up to 50,000 temperature profiles, built-in alarms, overheat protection, and voice warnings before operations complete.

In terms of performance, the station handles boards from 10×10 mm up to 550×450 mm; PCB thickness from 0.5 to 8 mm; BGA sizes 0.8 mm to 80 mm; minimum chip pitch 0.15 mm; mounting precision ±0.01 mm; and weight capacity up to 1,000 grams. Power is 6,800 W (top 1,200 W, bottom 1,200 W, IR 4,200 W) on AC 220V ±10%. The machine’s dimensions are ~670 × 780 × 850 mm and weight ~90 kg.

Whether repairing BGA, QFP, QFN, or chip components, the ZMW-750 Fully-auto BGA Rework Station provides automatic, accurate, and repeatable repair in SMT lines, reducing human error and improving rework yield.  
SPECIFICATION
 
Power 6800W
Up heater power 1200W
Down heater power 1200W
IR heater power 4200W(2400W control)
Power supply (Single Phase)  AC 220V±10 50Hz
Position way Optical lens+ Vshape holder+laser positioning
Temperature control High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material High sensitive touch screen+temperature control module+PLC+step drive
PCB Size Max:550×450mm  Min: 10×10mm
Thermo-couple Ports 4pcs
Chips magnification times 2-30
PCB thickness 0.5-8mm
BGA size 0.8mm-8cm
Min.chips pitch 0.15mm
Mounting BGA weight 1000G
Mounting precision ±0.01mm
Overall dimension L670×W780×H850mm
Optical alignment lens Motor drive can move front back right left
Weight of machine About 90kg
 
Power 6800W
Up heater power 1200W
Down heater power 1200W
IR heater power 4200W(2400W control)
Power supply (Single Phase)  AC 220V±10 50Hz
Position way Optical lens+ Vshape holder+laser positioning
Temperature control High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material High sensitive touch screen+temperature control module+PLC+step drive
PCB Size Max:550×450mm  Min: 10×10mm
Thermo-couple Ports 4pcs
Chips magnification times 2-30
PCB thickness 0.5-8mm
BGA size 0.8mm-8cm
Min.chips pitch 0.15mm
Mounting BGA weight 1000G
Mounting precision ±0.01mm
Overall dimension L670×W780×H850mm
Optical alignment lens Motor drive can move front back right left
Weight of machine About 90kg

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