MD-200 BGA rework station
MD-200 BGA rework station
  • MD-200 BGA rework station

MD-200 BGA rework station


Features
DH-200 is a mobile platform dedicated to BGA maintenance.
The top is heated by hot air, the bottom is heated by the original diode, and the heating area is equipped with a glass shield. The top can be moved up or down automatically. The bottom can be moved forward or backward.
High-precision temperature control technology, which can achieve precise temperature deviation at ±2°C. At the same time, the external temperature measuring connector can realize accurate analysis of real-time temperature curve.

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Product Details
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MD-200 BGA rework station
1. DH-200 is a mobile platform dedicated to BGA maintenance.
2. The top is heated by hot air, the bottom is heated by the original diode, and the heating area is equipped with a glass shield. The top can be moved up or down automatically. The bottom can be moved forward or backward.
3. Configure industrial PC, high-definition touch screen. Freely set the temperature curve, you can set the mode such as: "keep the same temperature", "instant curve analysis" and "voice warning before heating is completed", etc., you can also use the real-time actual temperature and temperature curve settings to analyze and correct the curve.
4. High-precision temperature control technology, which can achieve precise temperature deviation at ±2°C. At the same time, the external temperature measuring connector can realize accurate analysis of real-time temperature curve.
5. V-groove PCB work, fast and accurate positioning, suitable for various PCB board positioning.
6. The movable universal clamp can prevent damage to the components on the edge of the PCB, and is suitable for the repair of various PCBs.
7. Using magnet nozzles of different sizes, it is easy to replace and install, it can rotate freely 360°, and the suction nozzles can be customized as needed.
8. 6-8 sections of temperature can be set for top heating and bottom heating (up to 16 sections), 50,000 sets of temperature curves can be stored, which can be numbered, modified and applied according to different BGAs. Curve analysis, settings and adjustments can also be performed on the touch screen.
9. Voice warning 5-10 seconds before the completion of heating: remind the operator to pick up the bga chip in time. After heating, the cooling fan will work automatically, and when the temperature cools down to room temperature (<45°C), the cooling system will automatically stop to prevent the heater from aging.
10. CE certification approval.
SPECIFICATION
Total Power 2300W
Top hot air heater 450W
Bottom diode heater 1800W
Power AC220V±10     50Hz
Lighting Original led working light, any angle adjusted.
Operation mode High definition touch screen, intelligent conversational interface, digital system setting
Storage 5000 groups
Top heater movement Automatic up / down with button,  manual Right/left,
Bottom diode heating Manual right / left movement.
Positioning Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures.
Temperature control K sensor, close loop
Temp accuracy ±2℃
PCB size Max 170×220 mm Min 22×22 mm
BGA chip 2x2 mm - 80x80 mm
Minimum chip spacing 0.15mm
External temper sensor 1pc
Dimensions L540*W310*H500mm
Net weight 16KG

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