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MD-5830 BGA rework station
MD-5830 BGA rework station
  • MD-5830 BGA rework station

MD-5830 BGA rework station

Features
▶Upper heater can be moved up and down, front/rear, free rotation.
▶Lower heater can be moved up/down to maintain optimal distance from PCB.
▶The thermometer has a strong sense, and the temperature measurement is more accurate.
▶PCB clamp (V-slot) with universal clamp, suitable for all kinds of BGA.
▶8-stage heating can be set, and a large amount of temperature data can be stored.
▶Can be assembled with different sizes of nozzles, easy to replace and use, and can be customized.
▶Automatic power-off protection device in case of emergency.
▶CE certification.
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MD-5830 BGA rework station

What a BGA rework station can do?
A BGA rework station is a machine that can be used to refinish or repair printed circuit boards (PCBs) with ball grid array (BGA) packaging and surface-mounted devices (SMDs).

• Use vacuum suction cups to easily pick up bga chips after desulfurization.
• With a USB 2.0 interface, it can be connected to a computer or mouse to set the temperature curve or update the system.
• External temperature converter enables temperature monitoring and accurate analysis of real-time temperature.
• Using three heating zones, the upper and lower heaters are hot air, and the bottom heater is an infrared preheating zone.
• K-type closed loop control, temperature accuracy will be within ±2°C.
• High-power cooling fan to prevent PCB deformation.
• Voice prompt: There is a voice prompt 5s-10s before the completion of heating, so that the operator is ready.
• Safety measures: overheating protection and emergency stop function.
 
SPECIFICATION
Total Power 5200W
Top heater 1200W
Bottom heater 2nd 1200W, 3rd IR heater 2800W
Power AC220V±10％     50Hz
Lighting Original led working light, any angle adjusted.
Operation mode HD touch screen, intelligent conversational interface, digital system setting
Top air-flow knob For upper hot-air flow adjusting(especially, very small/big chips) 
Storage 50000 groups
Top heater movement Right/left, frontward/backward, rotate freely.
Positioning Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures.
Temperature control K sensor, close loop
Temp accuracy ±2℃
PCB size Max 410×370 mm Min 22×22 mm
BGA chip 2x2 - 80x80 mm
Minimum chip spacing 0.15mm
External temper sensor 1pc
Dimensions 570*610*570mm
Net weight 33KG

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