MD-5830 BGA rework station
MD-5830 BGA rework station
  • MD-5830 BGA rework station

MD-5830 BGA rework station

▶Upper heater can be moved up and down, front/rear, free rotation.
▶Lower heater can be moved up/down to maintain optimal distance from PCB.
▶The thermometer has a strong sense, and the temperature measurement is more accurate.
▶PCB clamp (V-slot) with universal clamp, suitable for all kinds of BGA.
▶8-stage heating can be set, and a large amount of temperature data can be stored.
▶Can be assembled with different sizes of nozzles, easy to replace and use, and can be customized.
▶Automatic power-off protection device in case of emergency.
▶CE certification.

Download Send Inquiry

Product Details
MD-5830 BGA rework station

What a BGA rework station can do?

A BGA rework station is a machine that can be used to refinish or repair printed circuit boards (PCBs) with ball grid array (BGA) packaging and surface-mounted devices (SMDs).

• Use vacuum suction cups to easily pick up bga chips after desulfurization.
• With a USB 2.0 interface, it can be connected to a computer or mouse to set the temperature curve or update the system.
• External temperature converter enables temperature monitoring and accurate analysis of real-time temperature.
• Using three heating zones, the upper and lower heaters are hot air, and the bottom heater is an infrared preheating zone.
• K-type closed loop control, temperature accuracy will be within ±2°C.
• High-power cooling fan to prevent PCB deformation.
• Voice prompt: There is a voice prompt 5s-10s before the completion of heating, so that the operator is ready.
• Safety measures: overheating protection and emergency stop function.

Total Power 5200W
Top heater 1200W
Bottom heater 2nd 1200W, 3rd IR heater 2800W
Power AC220V±10%     50Hz
Lighting Original led working light, any angle adjusted.
Operation mode HD touch screen, intelligent conversational interface, digital system setting
Top air-flow knob For upper hot-air flow adjusting(especially, very small/big chips) 
Storage 50000 groups
Top heater movement Right/left, frontward/backward, rotate freely.
Positioning Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures.
Temperature control K sensor, close loop
Temp accuracy ±2℃
PCB size Max 410×370 mm Min 22×22 mm
BGA chip 2x2 - 80x80 mm
Minimum chip spacing 0.15mm
External temper sensor 1pc
Dimensions 570*610*570mm
Net weight 33KG

Tips on getting accurate quotes from suppliers. Please include the following in your inquiry:
1. Personal or business information
2. Provide product request in great detail
3. Inquiry for MOQ, Unit Price, etc

Please make sure your contact information is correct. Your message will be sent directly to the recipient(s) and will not be publicly displayed. We will never distribute or sell your personal information to third parties without your express permission.