| Total power | 7600W |
| Upper heating power | 1200W |
| Lower heating power | 1200W |
| Infrared heating power | 5000W |
| power supply | Two-phase 220V, 50/60Hz |
| Targeting method | V-shaped card slot fixed PCB, laser positioning light fast positioning, through the joystick control motor can move the X and Y axes at will; |
| Number of drive motors and control area | 6 (the X, Y axis of the heating head of the split-edge control equipment moves, the X and Y axes of the alignment lens move, the heating head Z1 of the second temperature zone is electrically lifted, and the Z axis of the upper heating head moves up and down; |
| Whether the preheating area of the third temperature zone is movable | Yes (electric movement) |
| Whether the upper and lower heating heads can be moved as a whole | Yes (electric movement) |
| Whether the alignment lens is automatic | Yes (automatic movement or manual control movement) |
| Whether the device has a suction feeding device | Yes (standard) |
| The third temperature zone heating (preheating) method | Using German imported bright infrared heating tube (advantages: fast heating, when the equipment is heated normally, the temperature around the PCB motherboard and the temperature of the reworked chip position will not form a large temperature difference, so as to ensure that the PCB motherboard will not be deformed or twisted, which can better improve the soldering yield of the chip) |
| The second temperature zone control mode | Electric automatic lifting |
| Temperature control | High-precision K-type thermocouple (Ksensor) closed-loop control (Closed Loop), up and down independent temperature measurement Temperature control accuracy up to ±1 degrees; |
| Electrical material selection | Taiwan touch screen + high-precision temperature control module + Panasonic PLC + Panasonic servo + stepper drive |
| Maximum PCB size | 630*480mm(actual effective area, no repair dead angle) |
| Minimum PCB size | 10*10mm |
| Number of temperature measurement interfaces | 5 pcs |
| The chip zooms in and out | 2-50 times |
| PCB thickness | 0.5~8mm |
| Applicable chips | 0.8*0.8~80*80mm |
| Applicable minimum chip pitch | 0.15mm |
| Maximum placement load | 800g |
| Placement accuracy | ±0.01mm |
| Machine size | L970*W700*H830mm |
| Machine weight | APPROX. 170KG |
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