Two types of heads are available that bring the "1-head solution" to an even higher dimension capable of accommodating a wide range of components while maintaining high speed with no head replacement. High-speed general-purpose heads can be used for ultra-small (0201mm) chip components.
High-speed multi-purpose (HM : High-speed Multi) head
This universal type head made for high-speed mouuting and versatility supports from ultra-tiny chips of 0201mm to large-size components of 55 x 100 mm and height of 15 mm.
Improving mounter operation from component pickup to mounting and using high-speed XY axes achieved production of 95,000 CPH which is 5% higher than conventional models.
Mounting a new type wide-scan camera increases and expands recognition capability to support high speed mounting of components down to only □8 mm to □12 mm in size. Also, use of side lighting gives high-speed recognition of ball electrode components such as CSP (chip scale packages) and BGA (ball grid arrays).
Achieving a common platform allows selecting from 1-beam and 2-beam for configuring the X-axis according to production mode and mounting capability.
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