YAMAHA Ultra High Speed Modular YSM40R
Featurs Achieves revolutionary productivity of 200,000 CPH* giving it the world’s fastest speed on a compact platform ▶Highest productivity in the world! ▶Flexible response for different production configur
Featurs Achieves revolutionary productivity of 200,000 CPH* giving it the world’s fastest speed on a compact platform ▶Highest productivity in the world! ▶Flexible response for different production configur
Features All-purpose surface mounter with the highest speed in its class brings 1head solution evolution to a whole new level! ▶World’s fastest mounting speed in its class; 5% faster than the YSM20. ▶Featuring a
Like its predecessors, the FUJI NXT III has a variety of reconfigurable options including numerous types of positioning heads, various types of canister, pallet and belt feeders. Thanks to the possibility of a free choi
Fuji NXTIII M6III The NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips per h
Features Name: On-line high-speed three-dimensional solder paste inspection system Model: InSPIre-510 Type: Single rail Size: 510x505mm carrier board size; 480x490mm detection area
Feature ▶Ensuring the flexibility of handling and delivery of various components. ▶Reduced production time by optimizing Motion Sequence and sharing data between devices. ▶Through the use of three-dimensional lighting
Feature ▶SM Series is the best-selling product that has been verified by many customers around the world since its first launch in 2005. ▶Suitable for high-pixel visual method to mount IC components with high precision
X, Y, Z, three-axis motion, accurately realize the selective spraying process of various circuit boads to avoid non-coated areas such as connectors.
FEATURES ▶Single head (single beam) capable of placing an impressive component array including: 0402mm to 120x90x28mm ▶Capable of placing large connectors, odd-shaped components, and advanced packaging types such as Po
